FOCUS Enhancements FS453 User Manual download pdf (Page 38)

FS453/4 AND FS455/6 DATA SHEET: HARDWARE REFERENCE

9.6 Solder Re-flow Profiles

The following figures provide solder re-flow profiles for the PQFP and FBGA packages with lead and

lead-free solder options.

6°C/sec max.

Max. 235 +5, -0 °C

10sec +/-3sec

20~60sec

(Over 200°C)

3°C/sec Max.

140~160°C

60~120sec

3°C/sec Max.Max. 240°C

Cooling down(F)Re-flow peak(E)Maintain(D)Heat-up(C)Pre-heat(B)Heat-up(A)Peak Temp.

IR Re-flow Profile for Pre-conditioning

100

200

300

°C

E (Peak Temperature 235°C +5, -0 °C)

sec

IR Re

flow Profile

Figure 15 PQFP Package (Lead Solder)

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FOCUS Enhancements FS453 User Manual Page 38